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For bonding and
curing applications, induction heating
not only provides a better quality
bond, but also shortens the process
time required, allowing for faster
assembly of the final product.
Bonding
Used to join components together
with or without an epoxy, the bonding
process benefits from induction
heating’s localized heat application,
which dramatically reduces the length
of the hardening phase and allows
the product to move faster down
the production line.
Lepel equipment is available in
a wide range of power and frequency
levels to accommodate a variety
of bonding applications including
glass-to-metal, metal-to-metal (using
epoxy), plastic-to-metal (with or
without epoxy) and plastic-to-plastic
(using epoxy with magnetic filler).
Induction heating is also ideal
for controlled atmosphere bonding.
Metal assemblies may be joined without
flux, and the resulting joints are
strong and corrosion-free. The process
leaves smooth fillets and eliminates
fluxing and cleaning costs.
Curing
Curing is used to apply adhesives,
epoxies or other coatings to a finished
part. With induction heating, curing
times and coating fusion times are
accelerated significantly.
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